ASIM team
LIP6 Laboratory
Paris, France

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Conclusion

With the PCI-DDC/RCUBE chip-set, it is now possible to build high performance, low cost and scalable interconnection networks, based on the HSL IEEE-1355 technology. PCI-DDC is full compatible with RCUBE (same pin allocation and no GLU required). PCI-DDC does not degrade the PCI throughput, even for a small message size (80Mb/s for 128bytes message in and out simultaneously), and requires less than 3$\mu$s latency to transfer a one-word message. PCI-DDC, fabricated by Alcatel-Mietec in CMOS-0.5 micron process, is expected by the end of 1997. The PCI-DDC/RCUBE chip-set will be commercialized by BULL S.A.

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